SEMICONDUCTOR
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CMP PAD Double-sided Tape
| Product | Thickness(mm) | Adhesive Strength | Color | Material | Characteristic | |
|---|---|---|---|---|---|---|
| gf/25mm | N/cm | |||||
| P3170DR | 0.17 | 3,500 | 13.7 | YELLOW | PET | CMP PAD Permanent |
| CPT-0105Y-A | 0.105 | 3,200 | 12.5 | CMP PAD Removal | ||
Back Grinding Tape
| Product | Thickness(mm) | Adhesive Strength | Color | Material | Characteristic | |
|---|---|---|---|---|---|---|
| gf/25mm | N/cm | |||||
| AUBG0170S | 0.17 | 2,400(15) | 9.3(0.06) | Milky | PO | SI Wafer Polishing |
UV Dicing Tape
| Product | Thickness(mm) | Adhesive Strength | Color | Material | Characteristic | |
|---|---|---|---|---|---|---|
| gf/25mm | N/cm | |||||
| DC4090V4R | 0.09 | 400/800(20/20) | 1.8/3.1(0.07/0.07) | Blue | PVC | SI Wafer Dicing |
| DC3125E | 0.125 | 3,000(20) | 11.8(0.07) | Transparency | PET | Glass/Filter Dicing |
| UD3125E | 0.125 | 2,800(15) | 11.0(0.06) | |||
| UD2180P | 0.18 | 1,500(40) | 5.9(0.16) | PO | PCB Dicing | |
Main Number041-410-3500